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Embedded Systems November 2000 Vol13_12

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News Vectors Motorola to sign agreement with Lin eo Motorola, through its wholly owned subsidiary Metrowerks, is expected to acquire 3 million shares, or 8% of Lineo Inc. for the aggregat e price of $22.5 million. Lineo has agreed to sell Motorola two million warrants to be converted into common shares of Lineo. The companies intend the investment and strat egic partner- ship to result in a variety of joint product s and ser vices from all three corporations. Lineo and Metrowerks will work together to integrate Lineo's embedded Linux solution with Metrowerks' CodeWarrior I ntegrated Development Environment (IDE). CodeWarrior for Embedix will provide Linux developers with a package for creating embedded products. CodeWarrior for Embedix will support Motorola processor architectures including PowerPC, ColdFire, M-CORE, and 681<. Briefly Noted ... Atmel Wireless and Microcontrollers has opened a c hip-des ig n ce nter in Be .-lin- Charlouenburg to develop !Cs in Silicon Germanium technology. * Telelogic's North American opera- tion were hosen as winner of the 2000 Swedish Trade Council North America Annual Achievement Award. * Texas Instruments will pre-integrate Accelerated Technology's ucleus PLUS ker- nel in to its new TMS320 DSP-based enterprise Internet Protocol phone processor. * Altera has acquired privately held Northwest Logic, a provide r of sys tem design services and in te llectual property specializ- ing in telecommun ications, da ta communicatio ns, and embedded processor systems design . * In an Toshiba announces 0.11-micron advance I n the ongoing pursuit of higher system IC bandwidth, Toshiba America Electronics Components (TAEC) has announced the details of its 0.11-micron-drawn CMOS copper interconnect tech- nology and libraries. According to the company's announcement, the 0.11-micron technology gives designers the ability to mix and match threshold voltages. A t rench DRAM option permits both logic and DRAM functions on the same chip. Seven layers of inter- connect are available for cell, block, global, and power routing. In ASIC applications, the 0.11-micron technology enables logic densi- ties up to 2091

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