Power integration

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Sponsored by 2 Must reads Intro 3D Power Packaging with Focus on Embedded Substrate Technologies By Brian Narveson and Ernie Parker Co-chairmen, PSMA Packaging Committee Examining high current and high power density demands on POL converters By Jian Yin, Applications Engineering Manager, Intersil Corporation INSIDE 3 15 21 26 30 5 Power module redundancy By Bala Bellur, Pre-Sales Engineer, Vadatech 5 Power Trends Will Pay Off Soon By Paul Pickering Smartphones Feel the Heat By Jim McGregor, Principal, Tirias Research Power Integration

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